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                    PRODUCT

                    首页 ? Product ? LED Substrate And Window Sheet Manufacturing Equipment ? Magnetron Sputtering Coating Equipment

                    JGP-800 Magnetron Sputtering Film Coating Equipment
                    编号:SN20151119112851865
                    类别:Magnetron Sputtering Coating Equipment
                    • 产品概述
                    • 规格参数
                    • 服务支持

                          Application

                      The equipment is widely used in semi-conductor, LED and photovoltaic industries, and can meet the demand for scientific research and small volume production in thin film coating on various metal, semiconductor and medium materials.

                       Structure

                       

                      This is a single chamber equipment, which consists of sputtering vacuum chamber, magnetron sputtering target, ion bombardment, revolution substrate set, light heating system, sputtering power, gas circuit system, vacuum pumping system, vacuum measuring system, water cooling and alarm system, control system and supporting frame.

                      The system is controlled by IPC and PLC, and can be switched between manual and automatic mode. Apart from sample placing and fetching, all other operation is done on a touch screen, which provides operating UI for vacuum system, sputtering process setting, gas charging and exhaustion system; The processing procedure and system parameters can be set by setting formula parameter on IPC.


                      Technical Parameter

                      型号Model

                      JGP-800

                      溅射室极限真空 

                      Sputtering chamber ultimate vacuum pressure

                      8.0×10-6Pa

                      恢复真空时间

                      Time required for re-evacuation

                      系统从大气抽至1.0×10-3 Pa15min

                      ≤15min, re-evacuation from atmosphere

                      均匀性

                      Uniformity

                      膜厚不均匀性≤±5%;片间不均匀性≤±5%;批次间不均匀性≤±5%

                      Film thinness nonuniformity≤±5%;Inter-chip nonuniformity≤±5%;Batch nonuniformity≤±5%.

                      溅射真空室

                      Sputtering Vacuum Chamber

                      圆筒形结构,尺寸Ф800mmx250mm

                      Cylindrical shaped structure, size Ф800mmx250mm

                      磁控溅射系统

                      Magnetron sputtering system

                      永磁靶4支,靶材尺寸6英寸

                      4 × 6permanent magnetron targets;

                      1台进口电源(射频或直流脉冲可选);

                      One imported power (choice of RF or DC pulse)

                      溅射速率:0.55/秒(靶材Al

                      Sputtering velocity: 0.5-5 Å/sec (Target Al)

                      公转基片台

                      Revolution substrate table

                      6英寸6片,(4英寸12片或3英寸16片);

                      6×6substrate, (12×4substrate or 16×3substrate)

                      基片公转315/分,连续可调,可选配公自转复合工件台

                      Substrate revolution: 3-15rpm, constantly adjustable, revolution and self rotation combination plate is optional.

                      光加热系统

                      Light heating system

                      样品加热温度:室温~250°C,连续可调;

                      Sample heating temperature: room temperature-250, constantly adjustable;

                      基片温度不均匀性:≤±10°C

                      Substrate temperature nonuniformity: ≤±10°C;

                      控温方式为PID自动控温及数字显示,配备进口控温表

                      Temperature controlled: PID automatic temperature control and digital display, equipped with imported temperature controller.

                      工作气路

                      Gas path

                      2路质量流量控制器气路

                      2 way mass flow controller (MFC)

                      抽气机组

                      Pumping set

                      低温泵(进口)、罗茨干泵机组、气动闸板阀(进口)、管路等

                      Cryopump (imported), Roots dry pump set, pneumatic gate valve (imported), pipes

                      真空测量

                      Vacuum measurement

                      2个真空计(进口)对系统真空、工作真空及前级真空进行精确检测;真空度在工控机触膜屏上可直观显示;可准确监控溅射镀膜工艺过程的真空度

                      System vacuum, working vacuum and backing vacuum was precisely measured by 2 vacuum gauges (imported); the vacuum level can be displayed on IPC’s touch screen; the vacuum level of the magnetron sputtering process can be monitored accurately.

                      控制系统

                      Control system

                      系统由工控机(触摸屏)和进口PLC实现对整个系统的控制

                      The entire system can be controlled by IPC (touch screen) and PLC (imported)

                      占地面积

                      Space occupied

                      主机

                      Main set

                      1500×1000mm2

                      1500×1000mm2

                      电控柜

                      Power carbinet

                      700×700mm2(一个)

                      700×700mm2 (one)

                       

                       

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